The **ATS-03B-55-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin | | **Thermal Resistance** | 23.98°C/W (Unducted @ 100 LFM) | | **Dimensions (L x W)** | 40.00mm x 40.00mm | | **Height** | 10.00mm | --- ### Key Electronic Components & Features #### 1. Heat Sink Body (Aluminum) The body is constructed from high-grade aluminum. In electronics, aluminum is preferred for heat sinks due to its high thermal conductivity and lightweight properties. The **straight-fin design** maximizes surface area for convective cooling. #### 2. The pushPIN™ Attachment System Unlike adhesive-based heat sinks, this part uses a mechanical push-pin mechanism: * **Compression Springs:** These ensure consistent pressure (clamping force) between the heat sink and the electronic chip, which is vital for efficient heat transfer. * **Plastic/Brass Pins:** These lock into pre-drilled holes on the PCB (Printed Circuit Board). #### 3. Thermal Interface Material (TIM) The "R0" suffix typically denotes that the part comes with a pre-applied **Thermal Interface Material**. This material fills microscopic air gaps between the component and the heat sink to ensure maximum heat flow. #### 4. Blue Anodized Finish The blue anodization is not just for aesthetics; it provides: * **Corrosion Resistance:** Protects the aluminum from oxidation. * **Electrical Insulation:** Adds a thin non-conductive layer to the surface (though the base remains conductive). * **Improved Emissivity:** Slightly enhances radiant heat transfer. --- ### Performance Metrics The effectiveness of this part is measured by its **Thermal Resistance**. Lower values indicate better cooling: * **@ 100 LFM (0.5 m/s):** 23.98 °C/W * **@ 500 LFM (2.5 m/s):** 7.31 °C/W *Note: This shows that the part is highly dependent on airflow (active cooling) to function efficiently.*