The **ATS-03B-69-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, and power modules. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Brass) with Compression Spring | | **Dimensions (L x W x H)** | 45mm x 45mm x 20mm | | **Thermal Resistance** | 11.52°C/W (at 100 LFM) | | **Flow Direction** | Straight Fin | | **Interface Material** | T766 Phase Change Material (Pre-applied) | --- ### 2. Key Features and Design #### A. Fin Design * **Straight Fins:** This model uses a straight-fin design. These are optimized for high-velocity airflow environments where air is pushed through the channels to dissipate heat quickly. * **Pitch:** The spacing between the fins is engineered to minimize pressure drop while maximizing the surface area available for heat transfer. #### B. Mechanical Attachment * **Push Pins:** Uses a brass push pin mechanism. This provides a secure, vibration-resistant mount to the PCB. * **Compression Springs:** Each pin is equipped with a spring to ensure consistent downward pressure on the electronic chip, which optimizes the contact with the Thermal Interface Material (TIM). #### C. Thermal Interface Material (TIM) * The base comes pre-applied with **T766**, a high-performance phase-change material. This fills the microscopic air gaps between the heat sink and the component, significantly reducing thermal impedance. --- ### 3. Application Use Cases This specific heat sink is typically used for: 1. **High-Speed Networking:** Cooling FPGAs or ASICs in routers and switches. 2. **Embedded Systems:** Industrial PCs where mechanical stability (vibration resistance) is required. 3. **Power Electronics:** Transistors and voltage regulators that generate localized heat. --- ### 4. Thermal Performance Data Performance varies based on airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Unducted) | 11.52 | | 300 (Unducted) | 4.02 | | 500 (Unducted) | 2.80 |