The **ATS-03B-71-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance **Heat Sink** designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by Advanced Thermal Solutions to define its dimensions and thermal properties. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ HS | | **Attachment Type** | Push Pin (Spring-loaded) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 20mm | | **Thermal Resistance** | ~6.73°C/W (at 100 LFM) | --- ### 2. Key Component Features #### A. Fin Design The "71" in the part number indicates a specific fin pattern. These are typically **Straight Fins** or **Cross-Cut Fins** designed to optimize airflow. The design ensures that heat is efficiently transferred from the baseplate to the surrounding air. #### B. Attachment Mechanism (pushPIN™) Instead of using adhesive tape, this part uses a **Push Pin** system with a brass or plastic pin and a compression spring. * **Benefits:** Provides consistent pressure on the component (TIM - Thermal Interface Material) and allows for secure mounting to a PCB with pre-drilled holes. #### C. Thermal Interface Material (TIM) The "C2" suffix indicates that the heat sink comes pre-applied with **ATS-PPS-02** or a similar high-performance thermal grease, ensuring low thermal resistance between the chip and the metal. --- ### 3. Applications and Usage This part is commonly used in industrial and commercial electronics where space is limited but high heat dissipation is required: 1. **Telecommunications:** Cooling of high-speed networking chips. 2. **Embedded Systems:** Industrial PCs and controllers. 3. **Power Electronics:** Cooling of MOSFETs or voltage regulators. --- ### 4. Comparison of Thermal Performance The efficiency of this heat sink varies based on the airflow (LFM - Linear Feet per Minute): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 6.73 | | 200 (1.0 m/s) | 2.22 | | 500 (2.5 m/s) | 1.14 |