The **ATS-03B-92-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for securing cooling solutions to Printed Circuit Boards (PCBs). ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-03B-92-C2-R0 | | **Material** | Aluminum (Anodized Blue) | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 16.48°C/W (Unducted Flow @ 200 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 15mm | | **Fin Style** | Straight Fin (High Density) | --- ### 2. Physical Design & Construction * **Fin Geometry:** It features a straight-fin design. These fins are optimized to provide a large surface area for heat dissipation while maintaining a low profile to fit in space-constrained electronics. * **Material Science:** Constructed from **Aluminum 6063**, which offers a balance between thermal conductivity and weight. The **Blue Anodized** finish isn't just for aesthetics; it provides surface protection against corrosion and increases thermal emissivity. * **The Push-Pin Mechanism:** This part uses a spring-loaded push-pin assembly. * **Spring:** Provides consistent downward pressure on the processor/chip. * **Pins:** Designed for 3.0mm diameter holes in the PCB. --- ### 3. Thermal Performance Profile The efficiency of this part depends heavily on the airflow (LFM - Linear Feet per Minute) within the electronic enclosure: | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 16.48 | | 400 (2.0 m/s) | 6.11 | | 600 (3.0 m/s) | 4.34 | | 800 (4.0 m/s) | 3.51 | --- ### 4. Application Use-Cases This specific heat sink is commonly used for cooling: * **BGA (Ball Grid Array) Chips:** Such as CPUs, GPUs, or FPGAs. * **Telecommunications Gear:** Routers and switches where vertical space is limited to 15mm. * **Embedded Systems:** Industrial PCs where mechanical vibration requires a secure push-pin mount rather than simple adhesive tape. ### 5. Part Number Breakdown ```text ATS - 03 - B - 92 - C2 - R0 | | | | | | | | | | | +-- Revision Code | | | | +------- Thermal Interface Material (T766) | | | +------------ Fin Pitch/Pattern Identifier | | +---------------- Fin Height/Type | +--------------------- Push-Pin Series +-------------------------- Advanced Thermal Solutions ```