The **ATS-03B-94-C2-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** family of high-performance heat sinks. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Component Type** | Heat Sink | | **Series** | maxiFLOW™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 40mm x 40mm x 25mm | | **Thermal Resistance (Flowing Air)** | 4.49°C/W @ 200 LFM | | **Thermal Resistance (Static Air)** | 11.52°C/W | --- ### 2. Key Features and Parts #### A. The Heat Sink Body The body is designed with a **tapered fin pattern**. This geometry is engineered to maximize surface area while minimizing pressure drop, allowing for better airflow through the fins. The blue anodized finish is not just aesthetic; it provides surface protection and slightly improves thermal emissivity. #### B. The pushPIN™ Attachment System This part uses a specific mechanical mounting system instead of adhesive. It consists of: * **Brass/Steel Springs:** Provides a consistent "Normal Force" to ensure the heat sink remains in firm contact with the electronic component (CPU/GPU/FPGA). * **Plastic/Metal Pins:** These snap into pre-drilled holes on the PCB. #### C. Thermal Interface Material (TIM) The "R0" suffix typically indicates that the part comes with a pre-applied **Thermal Interface Material**. This is a specialized pad or grease located on the base of the heat sink that fills microscopic air gaps between the component and the metal, significantly improving heat transfer. --- ### 3. Application Use Cases This specific model is commonly used for cooling: * **Northbridge/Southbridge** chipsets on motherboards. * **FPGAs and ASICs** in telecommunications equipment. * **Embedded Systems** where vertical space allows for a 25mm height profile.