The **ATS-03C-159-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed to provide efficient cooling for electronic components like CPUs, GPUs, and other high-heat surface-mount devices. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics. Here is the breakdown: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Overall Dimensions** | 45.00mm x 45.00mm | | **Height (Fin height)** | 20.00mm | | **Pitch (Spacing)** | 1.14mm | | **Thermal Resistance** | 2.09°C/W (at 200 LFM) | --- ### 2. Design Characteristics This electronic cooling component utilizes several engineering features to manage heat effectively: * **Fin Pattern:** It features a **Fine-Pitch** design. This increases the surface area available for heat dissipation within a compact footprint. * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied. This is a high-performance phase-change material that ensures a low-resistance path between the component and the heat sink. * **Attachment Style:** It uses a **Push-Pin** mechanism with a brass/plastic pin and a stainless steel spring. This ensures consistent pressure (clamping force) on the electronic chip, which is vital for thermal performance. --- ### 3. Application Use Cases This part is commonly integrated into the following electronic systems: 1. **Telecommunications:** Cooling of high-speed network switches and routers. 2. **Embedded Systems:** Industrial PCs where space is limited but thermal output is high. 3. **Power Electronics:** Managing heat for large MOSFET arrays or voltage regulators. 4. **Computing:** Chipset cooling for motherboards or specialized processing units. --- ### 4. Thermal Performance Comparison Thermal resistance ($R_{th}$) determines how many degrees Celsius the component will rise per watt of power dissipated. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 3.94 | | 200 (1.0 m/s) | 2.09 | | 300 (1.5 m/s) | 1.67 | | 400 (2.0 m/s) | 1.44 |