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  • ATS-03D-07-C3-R0

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    The **ATS-03D-07-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **blueICE™** series and is designed for high-density electronic cooling. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45mm x 45mm x 12.7mm | | **Fin Style** | Straight (Push-Pin) | | **Thermal Resistance** | 17.09°C/W (Natural Convection) | | **Attachment Method** | Push-Pin (Steel) | | **Thermal Interface Material (TIM)** | T412 | --- ### 2. Core Electronic Components #### A. The Fin Geometry The "07" in the part number refers to a specific fin configuration. This model uses a **Straight-Fin** design. In electronics, straight fins are optimized for unidirectional airflow (e.g., air moving directly across a PCB from a system fan). #### B. The Attachment Mechanism (Push-Pin) Unlike adhesive-based heat sinks, this part uses a **brass/steel push-pin** system with a compression spring. * **Purpose:** It ensures a constant, high-pressure contact between the heat sink base and the electronic component (CPU, GPU, or FPGA). * **Benefit:** Provides reliable mechanical stability and improves heat transfer efficiency over time compared to tapes. #### C. Thermal Interface Material (TIM) The unit comes pre-applied with **T412**. This is a high-performance phase-change material or thermal tape designed to fill microscopic air gaps between the heat sink and the electronic chip, significantly reducing thermal impedance. --- ### 3. Application Use-Cases This part is typically found in the following electronic environments: 1. **Telecommunications:** Cooling of high-speed network processors. 2. **Embedded Systems:** Protecting SoCs (System on Chips) from thermal throttling. 3. **Industrial PCs:** Cooling power-dense components in small form-factor enclosures. ### 4. Part Number Breakdown ```text ATS - 03 D - 07 - C3 - R0 | | | | | | | | | +-- Revision Code | | | +------- Finish/Color (Blue Anodized) | | +------------ Fin Characteristic Code | +------------------ Series/Dimension Type +------------------------ Advanced Thermal Solutions ```
    ✨ Follow-up Questions
    • ⤷What is the difference between push-pin and clip-on mounting for this heat sink?
    • ⤷ How does the T412 TIM compare to standard thermal grease?
    • ⤷ What are the recommended airflow (LFM) requirements for the ATS-03D-07-C3-R0?