ATS-03D-124-C2-R0
AI

The **ATS-03D-124-C2-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*, specifically part of their "maxiFLOW" series. It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors.
### 1. Technical Specifications
The following table summarizes the physical and thermal characteristics of the component:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum (Blue Anodized) |
| **Attachment Method** | pushPIN™ |
| **Thermal Resistance** | 3.28°C/W (at 100 LFM) |
| **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 25.00mm |
| **Fin Pattern** | COARSE-PITCH |
| **Compatibility** | Universal / Square and Rectangular footprints |
---
### 2. Key Features and Design
#### A. maxiFLOW™ Fin Geometry
The "C2" designation refers to the specific fin design. The maxiFLOW profile features a flared fin structure which increases surface area for maximum heat dissipation while maintaining a low pressure drop. This is ideal for high-velocity airflow environments.
#### B. pushPIN™ Attachment System
Instead of simple adhesives, this model uses a **pushPIN™** system:
* **Secure Fit:** It uses a brass or plastic pin and a high-performance compression spring.
* **Constant Pressure:** Ensures consistent contact between the heat sink and the component, improving thermal transfer.
* **Pre-drilled Holes:** Requires specific hole patterns on the PCB for mounting.
#### C. Thermal Interface Material (TIM)
The part usually comes with a pre-applied **Phase Change Material (PCM)** or a high-performance thermal pad. This eliminates the need for manual application of thermal grease during assembly.
---
### 3. Electronic Application Use-Cases
* **Power Electronics:** Dissipating heat from MOSFETs or IGBTs in power supplies.
* **Telecommunications:** Cooling ASICs and FPGAs in networking switches and routers.
* **Computing:** Used as a secondary cooler for auxiliary chips or embedded processors on motherboards.
---
- ⤷
What are the specific PCB hole dimensions required for the pushPIN attachment?
- ⤷ How does the thermal resistance change as the Airflow (LFM) increases for this model?
- ⤷ Is this heat sink compatible with non-standard chip sizes using different thermal pads?