The **ATS-03D-129-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. ### 1. Technical Specifications Below are the primary technical parameters for this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ HS | | **Thermal Resistance (Flowing)** | 8.68°C/W (@ 100 LFM) | | **Thermal Resistance (Static)** | 1.50°C/W (@ 700 LFM) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 10.00mm | --- ### 2. Key Electronic Features #### A. pushPIN™ Attachment System The part utilizes a specialized push-pin mechanism designed for quick and secure mounting. This ensures a consistent pressure across the interface material, which is critical for maximizing thermal conductivity between the chip and the heat sink. #### B. High-Performance Fin Design The "D" in the part number often refers to the fin pattern (likely a **straight fin** or **cross-cut** design depending on the specific airflow optimization). This design is engineered to increase surface area without significantly obstructing airflow, allowing for efficient heat transfer even in compact enclosures. #### C. Thermal Interface Material (TIM) The **C2** designation typically indicates that the heat sink comes pre-applied with a high-performance **T766 Phase Change Material**. This simplifies the assembly process and ensures there are no air gaps between the electronic component and the aluminum base. --- ### 3. Application Use Cases This specific heat sink is commonly used in: * **Networking Equipment:** Routers, switches, and base stations. * **Embedded Systems:** Industrial PCs and IoT gateways. * **Power Supplies:** Cooling MOSFETs and voltage regulators. * **High-Speed Computing:** Cooling secondary chipsets on motherboards. ---