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  • ATS-03D-151-C1-R0

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    The **ATS-03D-151-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications The following table outlines the key physical and thermal characteristics of this specific model: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Attachment Type** | Push-pin (Spring-loaded) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 3.90°C/W (Unducted Flow @ 100 LFM) | | **Dimensions** | 35.00mm x 35.00mm x 20.00mm | | **Weight** | ~40.00 grams | --- ## 2. Key Component Features ### A. Fin Design This model utilizes a **Square-Fin** or **Cross-Cut** pattern. Unlike straight fins, this pattern allows for multi-directional airflow, making it highly efficient in "crowded" PCB environments where airflow direction may be turbulent or inconsistent. ### B. Attachment Mechanism: pushPIN™ The "R0" suffix indicates the use of the ATS pushPIN™ mounting system. * **Hardware:** It uses plastic or brass push-pins with a precise compression spring. * **Reliability:** This ensures a constant, high-pressure contact between the heat sink and the component, optimizing the thermal interface. * **Ease of Use:** It allows for quick installation and minimizes the risk of over-tightening which could crack a silicon die. ### C. Thermal Interface Material (TIM) Typically, these units come pre-applied with a **T766** high-performance thermal phase-change material or grease on the base, ensuring there are no air gaps between the heat sink and the electronic part. --- ## 3. Performance Analysis Thermal resistance is measured in **°C/W** (Degrees Celsius per Watt). A lower number indicates better cooling performance. * **At 100 LFM (Linear Feet per Minute):** 3.90 °C/W * **At 500 LFM:** 1.58 °C/W This data shows that the ATS-03D-151-C1-R0 is highly "active-cooling dependent"—its efficiency more than doubles when air velocity increases from a light breeze to a strong fan-driven flow. ---
    ✨ Follow-up Questions
    • ⤷ How do I calculate if this heat sink is sufficient for a 15W component?
    • ⤷ What is the difference between Blue Anodized and Black Anodized finishes for heat sinks?
    • ⤷ Are there alternative mounting options if my PCB doesn't have holes for push-pins?