The **ATS-03D-152-C2-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **blueICE™** series and is designed for electronic components that require efficient thermal management, such as CPUs, GPUs, and power modules. ### 1. Technical Specifications The part is characterized by its physical dimensions, thermal resistance, and material composition. | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-03D-152-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 35mm x 35mm x 15mm | | **Attachment Method** | push-PIN™ | | **Thermal Resistance** | 3.32°C/W (at 200 LFM) | | **Fin Style** | Straight Fin | | **Thermal Interface Material (TIM)** | T766 (High Performance) | --- ### 2. Key Electronic Components & Features #### A. The push-PIN™ Attachment System This heat sink uses a specialized **push-PIN™** mechanism. - **Component:** It consists of a pre-drilled hole set and a flexible spring-loaded pin. - **Benefit:** This ensures constant pressure on the electronic component, which improves heat transfer and prevents the heat sink from shifting during vibration or shipping. #### B. Thermal Interface Material (TIM) The "C2" in the part number indicates that it comes pre-applied with **T766 thermal phase change material**. - **Role:** It fills microscopic air gaps between the heat sink and the electronic chip (IC). - **Performance:** It offers lower thermal resistance than standard pads, allowing heat to flow more freely into the aluminum fins. #### C. Fin Design (Heat Dissipation) The **Straight Fin** geometry is optimized for forced-air cooling (fans). - In an electronic enclosure, airflow directed across these fins removes the heat collected from the semiconductor. - The blue anodized finish is not just for aesthetics; it provides surface protection and slightly improves radiation heat transfer. --- ### 3. Usage Context This part is typically used on **Printed Circuit Boards (PCBs)** where high-density components are located. ```python # Example of calculating temperature rise for this part # Formula: Rise = Power(W) * Thermal Resistance(C/W) power_consumption_watts = 10 thermal_resistance = 3.32 # @ 200 LFM airflow temp_rise = power_consumption_watts * thermal_resistance print(f"The component temperature will rise {temp_rise} degrees Celsius above ambient.") ``` ---