The **ATS-03D-196-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). Below is a detailed breakdown of its electronic and physical specifications. --- ### 1. General Specifications This part belongs to the **pushPIN™** series, designed for easy installation on Printed Circuit Boards (PCBs) to cool integrated circuits (ICs) and other heat-generating components. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-03D-196-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded bolts) | | **Thermal Resistance** | 18.11°C/W (at 100 LFM) | --- ### 2. Physical Dimensions The dimensions are critical for determining if the part will fit on a dense PCB without interfering with other electronic components. | Dimension | Value | | :--- | :--- | | **Size (L x W)** | 45mm x 45mm | | **Height** | 6mm (Low Profile) | | **Pin Pitch** | 38mm x 38mm | | **Weight** | ~15 grams | --- ### 3. Thermal Performance Data Thermal resistance indicates how efficiently the part moves heat away from the electronics. Lower values are better at higher airflows. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 (0.5 m/s)** | 18.11 | | **300 (1.5 m/s)** | 8.50 | | **500 (2.5 m/s)** | 6.47 | | **700 (3.5 m/s)** | 5.48 | --- ### 4. Key Electronic Applications This specific heat sink is "low profile" (only 6mm high), making it ideal for: * **Networking Equipment:** Routers and switches with limited vertical clearance. * **Embedded Systems:** Industrial PCs where space is at a premium. * **Power Supplies:** Cooling MOSFETs or voltage regulators. * **BGA Packages:** High-speed processors that generate significant localized heat. --- ### 5. Attachment Hardware The **"R0"** suffix usually refers to the specific hardware kit included: * **Push-Pins:** Plastic or brass pins that snap into pre-drilled PCB holes. * **Springs:** Compression springs ensure constant "pressure-path" contact between the heat sink and the chip. * **TIM (Thermal Interface Material):** Usually comes with a pre-applied high-performance thermal pad or grease (T766).