The **ATS-03D-30-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions Inc.* (ATS). Below is a detailed breakdown of its electronic and mechanical specifications. --- ### 1. General Specifications This part is designed for cooling electronic components such as CPUs, GPUs, or high-power transistors using a "Push-Pin" mounting mechanism. | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-03D-30-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | ### 2. Physical Dimensions Precision measurements are critical for PCB clearance and component fit. | Dimension | Measurement | | :--- | :--- | | **Length/Width (Footprint)** | 45mm x 45mm | | **Height** | 25mm | | **Fin Pitch** | Fine-Pitch | | **Pin Material** | Brass (with Stainless Steel Spring) | ### 3. Thermal Performance Thermal resistance indicates how efficiently the heat sink moves heat away from the semiconductor. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 LFM (1.0 m/s)** | 5.31 °C/W | | **300 LFM (1.5 m/s)** | 3.79 °C/W | | **400 LFM (2.0 m/s)** | 3.01 °C/W | | **500 LFM (2.5 m/s)** | 2.53 °C/W | --- ### 4. Key Electronic Design Features * **Push-Pin Attachment:** The use of a brass push-pin with a compression spring ensures a secure, consistent pressure on the electronic package, optimizing heat transfer and preventing damage during vibration. * **High Aspect Ratio Fins:** The "maxiFLOW™" fin geometry increases the surface area for heat dissipation while maintaining a low pressure drop, making it ideal for systems with limited airflow. * **Pre-applied TIM:** The inclusion of **T766** thermal interface material ensures that there is no air gap between the component (e.g., a chip) and the heat sink base, maximizing thermal conductivity right out of the box. * **Non-Conductive Finish:** The blue anodized coating provides corrosion resistance and a level of electrical insulation, though the primary heat transfer surface is usually machined flat for contact. --- ### 5. Application Examples * **BGA Cooling:** Ball Grid Array components that generate significant heat. * **Power Supplies:** Regulating temperatures of MOSFETs or voltage regulators. * **Telecommunications:** Cooling chips in high-speed networking hardware.