The **ATS-03D-31-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for efficient cooling of integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications The following table summarizes the key physical and thermal properties of this specific model: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Fin Type** | Straight Fin | | **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 10.00mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance (Unducted)** | 25.25 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 3.14 °C/W @ 100 LFM | --- ### 2. Key Electronic Components & Design Features #### A. The pushPIN™ Attachment System Unlike adhesive-based heat sinks, the **ATS-03D-31-C2-R0** uses a mechanical push-pin system. - **Spring Loading:** Ensures a precise and consistent downward pressure (load) on the electronic chip, which optimizes the thermal interface. - **Reliability:** This prevents the heat sink from shifting during vibration or thermal cycling, a common failure point in high-power electronics. #### B. Thermal Interface Material (TIM) The part comes pre-applied with **T766** thermal grease. - **Function:** This fills microscopic air gaps between the heat sink base and the electronic component (CPU, GPU, or FPGA). - **Efficiency:** T766 is designed for high thermal conductivity, reducing the "thermal bottleneck" at the junction. #### C. Fin Geometry (Straight Fin) The straight-fin design is optimized for **forced air cooling** (active cooling with fans). The vertical fins provide a large surface area for heat dissipation into the surrounding airflow. --- ### 3. Common Applications This heat sink is typically found in the following electronic systems: 1. **Networking Equipment:** Routers, switches, and base stations. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Electronics:** Voltage regulators and high-current modules. 4. **Telecommunications:** Data center hardware requiring low-profile cooling solutions (10mm height). ---