The **ATS-03D-33-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for efficient heat dissipation in compact electronic systems. --- ### 1. Key Technical Specifications | Parameter | Specification | |:---|:---| | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Fin Type** | Cross-Cut (Square-Fin) | | **Thermal Resistance** | 17.42°C/W (Unducted Flow @ 100 LFM) | --- ### 2. Physical Dimensions The part is designed for precision fitment on Integrated Circuits (ICs) and other heat-generating surface-mount devices. * **Overall Size:** 35mm x 35mm * **Height:** 20mm (Dimension "C") * **Pitch (Hole-to-Hole):** 40mm * **Weight:** ~25 grams --- ### 3. Electronic & Mechanical Features #### A. Thermal Performance The "Cross-Cut" fin design allows for airflow from multiple directions, making it ideal for systems where air movement might be turbulent or non-linear. The thermal resistance decreases significantly as airflow (LFM - Linear Feet per Minute) increases: * **@ 100 LFM:** 17.42 °C/W * **@ 700 LFM:** 2.65 °C/W #### B. The pushPIN™ Attachment System Unlike adhesive-based heat sinks, this model uses a mechanical push-pin system: * **Secure Fit:** Prevents the heat sink from shifting during vibration or shipping. * **Compression Spring:** Ensures consistent pressure between the heat sink and the electronic component (CPU/GPU/FPGA) for optimal heat transfer. * **Interface Material:** Usually comes pre-applied with a high-performance Thermal Interface Material (TIM) to fill microscopic air gaps. #### C. Material Properties The use of **Aluminum 6063** provides a balance between high thermal conductivity and structural integrity. The **Blue Anodized** finish is not just aesthetic; it provides corrosion resistance and increases surface emissivity. --- ### 4. Common Applications * **Telecommunications:** Cooling of networking switches and routers. * **Embedded Computing:** High-speed processors and FPGAs. * **Power Supplies:** Managing heat in voltage regulators and MOSFETs. ---