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  • ATS-03D-38-C2-R0

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    The **ATS-03D-38-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for efficient cooling of semiconductor devices like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The following table summarizes the physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Fin Type** | Straight Fin | | **Dimensions (L x W)** | 40.00 mm x 40.00 mm | | **Height** | 25.00 mm | | **Mounting Style** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 6.42°C/W (at 100 LFM) | | **Attachment Method** | Push Pins with Compression Springs | --- ### 2. Design and Component Breakdown #### A. Fin Geometry (Straight Fin) The "Straight Fin" design is optimized for **forced air convection**. It allows air from a system fan to flow through the channels with minimal resistance, effectively stripping heat away from the aluminum base. #### B. The pushPIN™ Attachment System Unlike adhesive-based heat sinks, this part uses a mechanical attachment system consisting of: - **Push Pins:** Usually made of brass or plastic. - **Compression Springs:** Provide consistent downward pressure (load) to ensure a tight interface between the heat sink and the electronic component. - **Pre-drilled Holes:** Requires the PCB to have specific hole patterns for installation. #### C. Thermal Interface Material (TIM) The "R0" suffix typically indicates that the part comes with a **pre-applied Thermal Interface Material**. This is a layer of phase-change material or thermal grease on the base of the heat sink, which fills microscopic air gaps between the chip and the metal to maximize heat transfer. --- ### 3. Part Number Breakdown (Nomenclature) To understand the electronic specifications better, here is how the part number is structured: | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Manufacturer) | | **03** | Series/Product Type | | **D** | Push Pin Type/Material | | **38** | Specific Size Reference | | **C2** | Specific Fin Height/Configuration | | **R0** | Packaging and Thermal Interface Material status | --- ### 4. Application Use-Case This part is commonly found in: - **Networking Equipment:** Switches and routers where high-speed processors generate significant heat. - **Industrial Computers:** Embedded systems requiring vibration-resistant mounting. - **Power Supplies:** Cooling voltage regulators or MOSFETs.
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for the pushPIN™ mounting system?
    • ⤷ How does the 'Blue Anodized' finish affect the thermal performance compared to bare aluminum?
    • ⤷ Can this heat sink be used in a passive cooling (fanless) environment?