ATS-03D-38-C2-R0
AI

The **ATS-03D-38-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for efficient cooling of semiconductor devices like CPUs, GPUs, or high-power transistors.
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### 1. Technical Specifications
The following table summarizes the physical and thermal characteristics of the part:
| Parameter | Specification |
| :--- | :--- |
| **Series** | pushPIN™ |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Fin Type** | Straight Fin |
| **Dimensions (L x W)** | 40.00 mm x 40.00 mm |
| **Height** | 25.00 mm |
| **Mounting Style** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 6.42°C/W (at 100 LFM) |
| **Attachment Method** | Push Pins with Compression Springs |
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### 2. Design and Component Breakdown
#### A. Fin Geometry (Straight Fin)
The "Straight Fin" design is optimized for **forced air convection**. It allows air from a system fan to flow through the channels with minimal resistance, effectively stripping heat away from the aluminum base.
#### B. The pushPIN™ Attachment System
Unlike adhesive-based heat sinks, this part uses a mechanical attachment system consisting of:
- **Push Pins:** Usually made of brass or plastic.
- **Compression Springs:** Provide consistent downward pressure (load) to ensure a tight interface between the heat sink and the electronic component.
- **Pre-drilled Holes:** Requires the PCB to have specific hole patterns for installation.
#### C. Thermal Interface Material (TIM)
The "R0" suffix typically indicates that the part comes with a **pre-applied Thermal Interface Material**. This is a layer of phase-change material or thermal grease on the base of the heat sink, which fills microscopic air gaps between the chip and the metal to maximize heat transfer.
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### 3. Part Number Breakdown (Nomenclature)
To understand the electronic specifications better, here is how the part number is structured:
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Advanced Thermal Solutions (Manufacturer) |
| **03** | Series/Product Type |
| **D** | Push Pin Type/Material |
| **38** | Specific Size Reference |
| **C2** | Specific Fin Height/Configuration |
| **R0** | Packaging and Thermal Interface Material status |
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### 4. Application Use-Case
This part is commonly found in:
- **Networking Equipment:** Switches and routers where high-speed processors generate significant heat.
- **Industrial Computers:** Embedded systems requiring vibration-resistant mounting.
- **Power Supplies:** Cooling voltage regulators or MOSFETs.
- ⤷
What are the PCB hole requirements for the pushPIN™ mounting system?
- ⤷ How does the 'Blue Anodized' finish affect the thermal performance compared to bare aluminum?
- ⤷ Can this heat sink be used in a passive cooling (fanless) environment?