The **ATS-03D-50-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from electronic integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ## 1. Technical Specifications The part number follows a specific nomenclature used by Advanced Thermal Solutions. Below are the primary technical characteristics: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 19.03°C/W (Natural Convection) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 15.00mm | | **Fin Style** | Straight Fin | --- ## 2. Component Breakdown ### A. The Heat Sink Body The body is made of **Aluminum 6063**, which is the industry standard for heat sinks due to its high thermal conductivity and lightweight properties. The **Blue Anodized** finish isn't just aesthetic; it provides: * Increased corrosion resistance. * Improved surface emissivity, which slightly enhances radiant heat transfer. ### B. The Mounting System (Push-Pins) The "03D" in the part number signifies the specific push-pin and spring assembly: * **Push-Pins:** These allow for easy installation into pre-drilled holes on a PCB (Printed Circuit Board). * **Compression Springs:** These ensure that a consistent and precise amount of pressure is applied to the component (TIM - Thermal Interface Material), which is critical for maximizing heat transfer efficiency. ### C. Thermal Performance The efficiency of this part is measured by its **Thermal Resistance (Rth)**. * In **Natural Convection** (no fan), it is rated at approximately **19.03°C/W**. * In **Forced Airflow** (with a fan), the resistance drops significantly (e.g., to ~3.5°C/W at 200 LFM), allowing it to cool high-power components effectively. --- ## 3. Applications and Usage This part is commonly used in: 1. **Telecommunications:** Cooling network switches and routers. 2. **Embedded Systems:** Protecting industrial PCs and controllers. 3. **Power Electronics:** Managing heat for voltage regulators and power modules. ### Installation Code Example (Simulated Placement) While this is a physical part, in PCB design software (like Altium or KiCad), the footprint would be defined by the hole spacing for the push-pins: ```markdown # PCB Layout Reference - Component Center: (X, Y) - Hole Diameter: 3.0mm - Hole-to-Hole Distance: 42.0mm (typically measured diagonally) - Keep-out Zone: 37mm x 37mm ``` ---