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  • ATS-03D-57-C2-R0

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    The **ATS-03D-57-C2-R0** is a specific high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push-pin" series designed to provide efficient thermal management for electronic components such as CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Heat Sink) / Brass (Pins) | | **Finish** | Blue Anodized | | **Dimensions** | 40mm x 40mm x 15mm | | **Thermal Resistance** | 13.16 °C/W (at 200 LFM) | | **Attachment Method** | Push-Pin (with 2-hole mounting) | | **Spring Type** | Compression Spring | | **Thermal Interface Material** | T766 (High performance) | --- ### 2. Component Analysis #### A. The Heat Sink Body The body is constructed from **Aluminum** and features a **Straight Fin** design. * **Fin Density:** The fins are spaced to allow for optimal airflow, whether used in passive (natural convection) or active (fan-forced) cooling scenarios. * **Blue Anodized Coating:** This is not just for aesthetics; the anodization process increases surface emissivity, which improves heat dissipation via radiation. #### B. Mounting Hardware (The "Push-Pin") The "03D" in the part number indicates the specific mounting hardware configuration: * **Brass Push-Pins:** These provide a secure, standardized attachment to the Printed Circuit Board (PCB). * **Plastic/Compression Springs:** These ensure consistent pressure between the heat sink base and the electronic chip, which is critical for maximizing heat transfer. #### C. Thermal Interface Material (TIM) The unit comes pre-applied with **T766 thermal grease**. * **Role:** This fills microscopic air gaps between the chip surface and the heat sink base. * **Efficiency:** T766 is a phase-change material that offers low thermal impedance. --- ### 3. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Manufacturer) | | **03** | Series/Mounting Style (Push-Pin) | | **D** | Hardware/Spring tension variant | | **57** | Dimensions/Design specific identifier | | **C2** | Thermal Interface Material (TIM) type (T766) | | **R0** | RoHS Compliant / Revision code | --- ### 4. Ideal Applications This part is commonly found in: 1. **Network Switches:** Cooling ASICs and processing units. 2. **Embedded Systems:** Industrial PCs where vibration resistance is needed (push-pins are more secure than tape). 3. **Power Supplies:** Managing heat for voltage regulators.
    ✨ Follow-up Questions
    • ⤷ What are the airflow requirements to achieve maximum cooling with this heat sink?
    • ⤷ How do push-pins compare to adhesive-based heat sink mounting?
    • ⤷ Is this heat sink compatible with standard 40mm fans for active cooling?