ATS-03D-57-C2-R0
AI

The **ATS-03D-57-C2-R0** is a specific high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push-pin" series designed to provide efficient thermal management for electronic components such as CPUs, GPUs, and other high-heat integrated circuits.
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### 1. Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (Heat Sink) / Brass (Pins) |
| **Finish** | Blue Anodized |
| **Dimensions** | 40mm x 40mm x 15mm |
| **Thermal Resistance** | 13.16 °C/W (at 200 LFM) |
| **Attachment Method** | Push-Pin (with 2-hole mounting) |
| **Spring Type** | Compression Spring |
| **Thermal Interface Material** | T766 (High performance) |
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### 2. Component Analysis
#### A. The Heat Sink Body
The body is constructed from **Aluminum** and features a **Straight Fin** design.
* **Fin Density:** The fins are spaced to allow for optimal airflow, whether used in passive (natural convection) or active (fan-forced) cooling scenarios.
* **Blue Anodized Coating:** This is not just for aesthetics; the anodization process increases surface emissivity, which improves heat dissipation via radiation.
#### B. Mounting Hardware (The "Push-Pin")
The "03D" in the part number indicates the specific mounting hardware configuration:
* **Brass Push-Pins:** These provide a secure, standardized attachment to the Printed Circuit Board (PCB).
* **Plastic/Compression Springs:** These ensure consistent pressure between the heat sink base and the electronic chip, which is critical for maximizing heat transfer.
#### C. Thermal Interface Material (TIM)
The unit comes pre-applied with **T766 thermal grease**.
* **Role:** This fills microscopic air gaps between the chip surface and the heat sink base.
* **Efficiency:** T766 is a phase-change material that offers low thermal impedance.
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### 3. Part Number Breakdown
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Advanced Thermal Solutions (Manufacturer) |
| **03** | Series/Mounting Style (Push-Pin) |
| **D** | Hardware/Spring tension variant |
| **57** | Dimensions/Design specific identifier |
| **C2** | Thermal Interface Material (TIM) type (T766) |
| **R0** | RoHS Compliant / Revision code |
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### 4. Ideal Applications
This part is commonly found in:
1. **Network Switches:** Cooling ASICs and processing units.
2. **Embedded Systems:** Industrial PCs where vibration resistance is needed (push-pins are more secure than tape).
3. **Power Supplies:** Managing heat for voltage regulators.
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What are the airflow requirements to achieve maximum cooling with this heat sink?
- ⤷ How do push-pins compare to adhesive-based heat sink mounting?
- ⤷ Is this heat sink compatible with standard 40mm fans for active cooling?