The **ATS-03D-58-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" family, designed for cooling electronic components such as CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 40.00 mm x 40.00 mm | | **Height** | 15.00 mm | | **Pitch** | Fine-Pitch | | **Thermal Resistance** | 10.11°C/W (Unducted Flow @ 1.0 m/s) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Design Breakdown #### A. Fin Geometry (Cross-Cut) This model uses a **cross-cut** fin pattern. Unlike straight fins, cross-cut fins allow for multi-directional airflow, making them more efficient in systems where air direction might be turbulent or restricted. #### B. Attachment Mechanism It utilizes a **pushPIN™** system which includes: * **Compression Springs:** Provide a precise amount of force to ensure the heat sink remains in contact with the component. * **Brass/Plastic Pins:** Used to secure the assembly to pre-drilled holes in the Printed Circuit Board (PCB). #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates the use of **T766 phase-change material**. This is pre-applied to the base of the heat sink to fill microscopic air gaps between the heat sink and the heat source, significantly improving thermal conductivity. --- ### 3. Part Number Nomenclature Understanding the code helps in identifying the specific configuration: | Code Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **03** | Push-pin style/attachment type | | **D** | Material / Surface Area profile | | **58** | Dimension Identifier (specific to size 40x40x15) | | **C2** | Thermal Interface Material type (T766) | | **R0** | RoHS compliant / Revision status | --- ### 4. Application Use-Cases * **Embedded Systems:** Cooling processors on industrial motherboards. * **Networking Gear:** Regulating heat on high-speed switches or routers. * **Power Supplies:** Heat dissipation for MOSFETs or VRMs.