The **ATS-03D-66-C2-R0** is a specific part number for a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" thermal management series, designed to cool electronic components like CPUs, GPUs, and other integrated circuits. --- ### 1. Technical Specifications Table The following table highlights the core physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Base Material** | Aluminum (Blue Anodized) | | **Fin Type** | Cross-Cut (Square Pin) | | **Dimensions** | 45.00mm x 45.00mm x 35.00mm | | **Attachment Method** | pushPIN™ (Spring-loaded plastic pins) | | **Thermal Resistance** | 5.77°C/W (Unducted Flow @ 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to describe the heat sink's geometry and mounting: 1. **ATS-03**: Denotes the specific product series and pin configuration. 2. **D**: Indicates the thermal resistance class or specific fin density. 3. **66**: Represents the specific dimensions and profile height (35mm in this case). 4. **C2**: Specifies the material and finish (Aluminum with Blue Anodized finish). 5. **R0**: Refers to the revision and packaging standard. --- ### 3. Key Electronic/Thermal Features * **Heat Dissipation:** The "Cross-Cut" square pin design allows for omnidirectional airflow. This is critical in electronics where air may be blowing from multiple angles, ensuring the component doesn't overheat regardless of the fan placement. * **PushPIN™ Technology:** This mounting system uses a flexible, spring-loaded mechanism. It provides precise pressure on the electronic chip, which optimizes the contact between the chip surface and the heat sink base, improving thermal conductivity. * **Integrated TIM:** The **T766** Thermal Interface Material is pre-applied to the base. This "grey phase" material fills microscopic air gaps between the heat sink and the electronic component (like a processor), significantly lowering the thermal resistance. * **High Aspect Ratio:** At 35mm tall, this is a "high profile" heat sink intended for applications where vertical space is available but thermal load is significant. --- ### 4. Common Applications This part is typically found in: * **Networking Equipment:** High-speed routers and switches. * **Industrial PCs:** Motherboards requiring active or passive cooling. * **Power Electronics:** Cooling for MOSFETs or IGBT modules.