The **ATS-03D-71-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits (ICs). --- ### 1. Technical Specifications The following table summarizes the physical and thermal properties of the component: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (with Springs) | | **Dimensions** | 45mm x 45mm | | **Height** | 10mm | | **Thermal Resistance** | 6.69°C/W (at 200 LFM) | | **Airflow** | Vertical / Unducted | --- ### 2. Electronic/Mechanical Parts Breakdown #### A. The Heat Sink Body (Fins) The device utilizes a **cross-cut fin pattern**. In electronics, this design is critical because it allows for multi-directional airflow. Unlike straight-fin heat sinks that require air to travel in one specific path, cross-cut fins are more efficient in congested PCBS where airflow direction might vary. #### B. Push Pin Fasteners The "03D" in the part number indicates the specific attachment hardware. * **Material:** Plastic (usually Nylon) or Brass. * **Function:** These pins snap into pre-drilled holes in the PCB. This provides a secure, vibration-resistant mount compared to simple adhesive tapes. #### C. Compression Springs Between the push pin head and the heat sink sits a tension spring. This serves a vital electronic purpose: **Constant Pressure**. It ensures the heat sink maintains firm contact with the die of the component, compensating for thermal expansion and contraction during power cycles. #### D. Thermal Interface Material (TIM) The "R0" suffix typically indicates that the part comes with a pre-applied **Phase Change Material (PCM)** or a thermal pad on the base. This fills the microscopic air gaps between the component and the metal, significantly lowering the thermal resistance. --- ### 3. Application Use Cases * **Power Supplies:** Cooling MOSFETs and Voltage Regulators. * **Networking:** Cooling high-speed Ethernet controllers or small FPGAs. * **Embedded Systems:** Ideal for low-profile enclosures where height is restricted to 10mm.