ATS-03D-72-C3-R0
AI

The **ATS-03D-72-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for securing cooling solutions to PCBs.
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### Technical Specifications
The following table outlines the physical and thermal properties of the component:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) |
| **Base Part Number** | ATS-03D-72-C3-R0 |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Brass) |
| **Fin Type** | Straight |
| **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 15.00mm |
| **Thermal Resistance** | 5.19°C/W (Unducted Flow @ 200 LFM) |
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### Key Components & Features
#### 1. Push-Pin Attachment Mechanism
The "72" in the part number designates a specific push-pin and spring combination.
* **Brass Push-Pins:** Provide a secure and durable attachment to the PCB.
* **Compression Springs:** Ensure consistent pressure between the heat sink and the electronic component (CPU, GPU, or FPGA), maximizing heat transfer.
#### 2. Thermal Interface Material (TIM)
* This model typically comes pre-applied with **T412**, a high-performance thermal tape or grease.
* This fills microscopic air gaps between the heat sink base and the chip to reduce thermal resistance.
#### 3. Material and Coating
* **Aluminum Construction:** Offers a lightweight solution with high thermal conductivity.
* **Blue Anodizing:** Besides aesthetics, the anodized finish protects the aluminum from corrosion and slightly increases surface emissivity for better radiant heat transfer.
#### 4. Fin Design
* The **Straight Fin** geometry is optimized for "ducted" or "open" airflow environments. It allows air to pass through the channels easily, stripping heat away from the vertical surfaces.
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### Applications
This part is commonly used for cooling:
* **BGA (Ball Grid Array)** components.
* Power supplies and high-speed processors.
* Telecommunications equipment and industrial controllers.
- ⤷
What is the difference between ducted and unducted thermal resistance for this part?
- ⤷ Are there alternative push-pin materials available for this heat sink series?
- ⤷ How do I calculate the required airflow (LFM) for my specific chip wattage?