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  • ATS-03D-72-C3-R0

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    The **ATS-03D-72-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for securing cooling solutions to PCBs. --- ### Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Base Part Number** | ATS-03D-72-C3-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Fin Type** | Straight | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 15.00mm | | **Thermal Resistance** | 5.19°C/W (Unducted Flow @ 200 LFM) | --- ### Key Components & Features #### 1. Push-Pin Attachment Mechanism The "72" in the part number designates a specific push-pin and spring combination. * **Brass Push-Pins:** Provide a secure and durable attachment to the PCB. * **Compression Springs:** Ensure consistent pressure between the heat sink and the electronic component (CPU, GPU, or FPGA), maximizing heat transfer. #### 2. Thermal Interface Material (TIM) * This model typically comes pre-applied with **T412**, a high-performance thermal tape or grease. * This fills microscopic air gaps between the heat sink base and the chip to reduce thermal resistance. #### 3. Material and Coating * **Aluminum Construction:** Offers a lightweight solution with high thermal conductivity. * **Blue Anodizing:** Besides aesthetics, the anodized finish protects the aluminum from corrosion and slightly increases surface emissivity for better radiant heat transfer. #### 4. Fin Design * The **Straight Fin** geometry is optimized for "ducted" or "open" airflow environments. It allows air to pass through the channels easily, stripping heat away from the vertical surfaces. --- ### Applications This part is commonly used for cooling: * **BGA (Ball Grid Array)** components. * Power supplies and high-speed processors. * Telecommunications equipment and industrial controllers.
    ✨ Follow-up Questions
    • ⤷ What is the difference between ducted and unducted thermal resistance for this part?
    • ⤷ Are there alternative push-pin materials available for this heat sink series?
    • ⤷ How do I calculate the required airflow (LFM) for my specific chip wattage?