The **ATS-03D-86-C2-R0** is a specific electronic component primarily classified as a **High-Performance Heat Sink**. It is part of the "pushPIN™" series manufactured by **Advanced Thermal Solutions (ATS)**. --- ### 1. Technical Specifications The table below highlights the core physical and thermal characteristics of this component. | Characteristic | Specification | | :--- | :--- | | **Product Type** | Heat Sink | | **Thermal Resistance** | 2.50 °C/W (at 100 LFM) | | **Fin Type** | Fine-Pitch | | **Fin Pattern** | Straight | | **Attachment Method** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 15.00mm | --- ### 2. Key Features and Components To understand the "electronic parts" or design elements of this assembly, we can break it down into its functional segments: #### A. Thermal Interface Material (TIM) The "R0" at the end of the part number usually signifies the pre-applied thermal interface material. * **Material:** Usually high-performance phase-change material or thermal grease. * **Purpose:** To eliminate air gaps between the heat source (CPU/GPU/FPGA) and the heat sink base, ensuring maximum heat transfer. #### B. PushPIN™ Attachment Mechanism Unlike adhesive-based heat sinks, this part uses a mechanical fastening system: * **Springs:** Provides consistent pressure (Pre-assembled with a compression spring). * **Pins:** Designed to fit into 3.00mm diameter holes in the PCB. * **Engagement:** Ensures the heat sink remains secure during vibration or shock. #### C. Fin Geometry * The **Fine-Pitch** design increases the surface area available for heat dissipation without significantly increasing the physical footprint. * It is optimized for forced air cooling (airflow from fans). --- ### 3. Application Use Cases This component is typically used in high-density electronic environments such as: 1. **Telecommunications:** Cooling of high-speed processors in switches and routers. 2. **Embedded Systems:** Protecting SoCs (System on Chips) from thermal throttling. 3. **Industrial Controls:** Heat management for power-intensive components on compact PCBs. --- ### 4. Part Number Breakdown (Example) `ATS-03D-86-C2-R0` * **ATS:** Advanced Thermal Solutions (Manufacturer). * **03:** series identifier. * **D:** Attachment type / Performance level. * **86:** Specific design/size configuration. * **C2:** Material/Finish code (Blue Anodized). * **R0:** Thermal Interface Material / Packaging variant.