The **ATS-03E-07-C2-R0** is a specific part number for a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" series designed for cooling electronic components like CPUs, GPUs, and FPGAs. ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 16.97°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 12.7mm | | **Fin Style** | XC-Cut (Cross-Cut) | --- ### 2. Electronic Component Breakdown #### A. The Heatsink Body * **XC-Cut Design:** Unlike straight-fin heatsinks, the XC-cut (cross-cut) pattern allows for omnidirectional airflow. This means it can capture air from any direction, making it more efficient in cramped electronic enclosures. * **Aluminum Construction:** Chosen for its balance between thermal conductivity, weight, and cost. * **Blue Anodized Finish:** This is not just for aesthetics; the anodization layer provides a small degree of electrical insulation and increases the surface emissivity, slightly improving radiant heat transfer. #### B. Mounting Hardware (The "03E" Designation) * **Push Pins:** This part uses plastic push pins that snap into pre-drilled holes on the Printed Circuit Board (PCB). * **Compression Springs:** These ensure a consistent "clamping force" (pressure) between the heatsink and the chip, which is critical for maximizing the efficiency of the Thermal Interface Material (TIM). #### C. Thermal Interface Material (TIM) * The **"R0"** suffix typically indicates that the part comes with a pre-applied thermal tape or phase-change material on the base. This eliminates the need for manual application of thermal paste during assembly. --- ### 3. Typical Applications This component is generally used to manage the thermal load of: 1. **Network Switches/Routers:** Cooling high-speed processing chips. 2. **Industrial PCs:** Ensuring stability in high-temperature environments. 3. **Power Supplies:** Cooling MOSFETs or Voltage Regulators. ---