The **ATS-03F-02-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** manufactured by Advanced Thermal Solutions (ATS). It is designed for cooling electronic components such as CPUs, GPUs, or high-power semiconductors. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ HS | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 23.98°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 15mm | | **Fin Type** | Fine Pitch (Straight Fin) | --- ### 2. Design and Component Breakdown #### A. The Heat Sink Body Constructed from high-grade aluminum, the body features a "Fine Pitch" fin design. This increases the surface area available for heat dissipation while maintaining a compact footprint (40mm x 40mm). #### B. The pushPIN™ Attachment Unlike adhesive-based heatsinks, the `ATS-03F-02-C2-R0` utilizes a mechanical push-pin system. * **Springs:** Provides consistent pressure to ensure the thermal interface material (TIM) makes perfect contact with the heat source. * **Pins:** Designed to fit into standard holes on a Printed Circuit Board (PCB). #### C. Thermal Interface Material (TIM) The "C2" in the part number typically indicates that the heatsink comes pre-applied with **T766 Phase Change Material**. This eliminates the need for manual thermal paste application and ensures uniform coverage. --- ### 3. Thermal Performance Analysis Performance is measured by how effectively the part moves heat away from the chip into the surrounding air. | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 23.98 | | 300 (1.5 m/s) | 8.31 | | 500 (2.5 m/s) | 5.49 | | 700 (3.5 m/s) | 4.47 | --- ### 4. Key Advantages 1. **Mechanical Reliability:** The push-pin design is more vibration-resistant than thermal tape. 2. **Ease of Assembly:** Features a "snap-on" mechanism that reduces labor time during manufacturing. 3. **Low Profile:** At only 15mm tall, it is suitable for 1U server racks or low-profile consumer electronics.