The **ATS-03F-03-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, which is designed for high-velocity airflow environments. --- ## 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-03F-03-C2-R0 | | **Series** | maxiFLOW™ | | **Attachment Method** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 15.00mm | | **Thermal Resistance** | 15.85°C/W (Unducted Flow @ 100 LFM) | | **TIM (Thermal Interface Material)** | T766 (High Performance Phase Change) | --- ## 2. Key Electronic Features ### A. pushPIN™ Attachment System The "R0" designation indicates the use of the **pushPIN™** system. This is a specialized mounting mechanism that uses a compression spring and a plastic pin. It ensures: * **Constant Pressure:** Maintains uniform contact between the heat sink and the electronic component (CPU, GPU, or FPGA). * **Vibration Resistance:** Securely locks the part in place, preventing shifting during transport or operation. ### B. maxiFLOW™ Fin Geometry The fin design is not a standard square grid. It uses a **flared fin** geometry. This design increases the surface area for radiation and convection while reducing the pressure drop across the heat sink. This is critical for dense PCB layouts where airflow may be restricted. ### C. Thermal Interface Material (T766) This part comes pre-applied with **T766 TIM**. This is a "Phase Change" material that softens at operating temperatures to fill microscopic air gaps between the heat sink and the chip, significantly lowering the thermal resistance. --- ## 3. Application Use Cases This component is typically found in high-reliability electronic systems, including: * **Telecommunications:** Cooling high-speed network processors. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Electronics:** Small-form-factor power supplies and voltage regulators.