The **ATS-03F-07-C3-R0** is a specific high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **pushPIN™** series, designed to provide secure and efficient cooling for electronic components like CPUs, GPUs, and FPGAs. ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Body), Copper (Optional Base in some variants) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45mm x 45mm x 12.7mm | | **Attachment Type** | pushPIN™ (Spring-loaded plastic or brass pins) | | **Thermal Resistance** | 17.09 °C/W (at 100 LFM) to 2.32 °C/W (at 700 LFM) | | **Fin Type** | Fine Pitch (Straight Fin) | --- ### Key Components & Features 1. **Fin Design:** The "Fine Pitch" straight fin design provides a large surface area for heat dissipation. This is particularly effective in systems with high-velocity airflow (forced convection). 2. **Attachment Mechanism (pushPIN™):** Instead of using messy adhesives or simple clips, this unit uses pre-assembled push pins and springs. This ensures: * **Consistent Pressure:** Even contact between the heat sink and the component. * **Easy Installation:** Quick manual installation into pre-drilled holes on the PCB. * **Reliability:** High vibration resistance for industrial environments. 3. **Thermal Interface Material (TIM):** The "R0" suffix usually indicates that the heat sink comes with a pre-applied high-performance **T766 Phase Change Material** or similar thermal pad, ensuring optimal heat transfer from the chip to the aluminum. 4. **Blue Anodized Finish:** Beyond aesthetics, the anodized coating increases the surface emissivity, slightly improving radiant heat transfer and providing corrosion resistance. --- ### Applications * **Integrated Circuits (ICs):** Cooling of microprocessors and chipsets. * **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. * **Networking Gear:** Used in routers and switches where space is limited but thermal loads are high.