The **ATS-03F-100-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors. --- ### Technical Specifications Below are the primary physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 45.00mm x 45.00mm | | **Height** | 25.00mm | | **Thermal Resistance** | 4.84°C/W (Unducted Flow @ 100 LFM) | | **Weight** | ~48.0 grams | --- ### Key Components & Design Features #### 1. The Fin Profile The "03F" in the part number indicates a specific fin pattern. ATS uses a **cross-cut** or **straight fin** design (depending on the exact sub-series) to maximize surface area while allowing airflow from multiple directions. #### 2. Push-Pin Attachment Instead of using messy thermal adhesives or fragile clips, this part uses the **pushPIN™** system. * **Spring-loaded mechanism:** Ensures constant, uniform pressure across the component surface (TIM). * **Hardware:** It typically comes with a stainless steel spring and a plastic or brass pin to secure the unit to the PCB holes. #### 3. Thermal Interface Material (TIM) The "C2" suffix indicates that the heat sink comes pre-applied with **ATS-PPS-02** thermal grease. This eliminates the need for manual application and ensures optimal thermal conductivity between the chip and the aluminum base. --- ### Thermal Performance Table Thermal resistance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 4.84 | | 300 (1.5 m/s) | 1.87 | | 500 (2.5 m/s) | 1.30 | | 700 (3.5 m/s) | 1.07 | --- ### Applications * **Embedded Systems:** Industrial PCs and controllers. * **Networking:** Routers, switches, and high-speed modems. * **Power Supplies:** Cooling MOSFETs and voltage regulators. * **Telecommunications:** Base station hardware where vertical space (25mm) is available.