The **ATS-03F-11-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 50mm x 50mm x 10mm | | **Attachment Method** | Push-Pin (2-pin) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 18.74°C/W (Unducted Flow @ 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (High performance) | --- ### 2. Key Components & Construction The part is engineered using the **push-pin** mounting system, which is common in PCB assemblies for secure attachment without the need for adhesives. * **Heat Sink Body:** Features a "Cross-Cut" or straight fin design (depending on the specific sub-series) to allow airflow from multiple directions. The 10mm low-profile height makes it ideal for compact enclosures. * **Push-Pins:** Usually made of plastic or brass, these provide a reliable mounting mechanism that exerts consistent pressure on the heat source. * **Compression Springs:** These ensure that the heat sink remains in firm contact with the electronic chip, compensating for vibration or thermal expansion. * **Thermal Interface Material (TIM):** Pre-applied to the base, the T766 material fills microscopic air gaps between the component and the heat sink to maximize heat transfer. --- ### 3. Applications This specific model is typically used in the following electronic environments: 1. **Telecommunications:** Cooling of networking chips in routers and switches. 2. **Embedded Systems:** Providing thermal relief for SoCs (System on Chips) in industrial computers. 3. **Power Electronics:** Managing heat for VRMs (Voltage Regulator Modules) or power MOSFETs. --- ### 4. Thermal Performance Comparison The effectiveness of the heat sink changes based on the velocity of air (Linear Feet per Minute - LFM) provided by system fans: | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Static) | 18.74 | | 300 | 5.09 | | 500 | 3.51 | ---