The **ATS-03F-116-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **push-pin** attachment series, specifically designed for cooling electronic components like CPUs, GPUs, or high-power semiconductors. ### 1. Technical Specifications The following table highlights the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Type** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Overall Dimensions** | 40mm x 40mm x 30mm | | **Fin Pattern** | Straight (High-Flow) | | **Thermal Resistance** | 4.14 °C/W (at 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Features and Components To understand how this electronic part functions, we must look at its sub-components: #### A. The Heat Sink Body * **AL6063 Aluminum:** Chosen for its high thermal conductivity and lightweight properties. * **Fin Design:** The vertical fins are optimized for **forced air cooling** (fans). The 30mm height provides a large surface area for heat dissipation into the surrounding environment. #### B. The Push-Pin Mechanism * **Ease of Assembly:** The brass push-pins use a spring-loaded mechanism that snaps into pre-drilled holes on a Printed Circuit Board (PCB). * **Constant Pressure:** The compression springs ensure that the heat sink maintains even and constant pressure against the electronic component, which is critical for maximizing thermal transfer. #### C. Thermal Interface Material (TIM) * The **T766** is a pre-applied phase-change material or thermal grease. It fills microscopic air gaps between the component die and the aluminum base of the heat sink, significantly reducing thermal resistance. --- ### 3. Application Use Cases This specific model is commonly used in the following electronic environments: 1. **Networking Hardware:** Cooling high-speed processors in routers and switches. 2. **Embedded Systems:** Industrial PCs where space is limited but thermal loads are high. 3. **Power Supplies:** Managing heat for MOSFETs or voltage regulators. --- ### 4. Comparison of Thermal Performance Thermal resistance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Low) | 4.14 | | 300 (Medium) | 1.83 | | 500 (High) | 1.28 |