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  • ATS-03F-117-C2-R0

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    The **ATS-03F-117-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" series designed for cooling electronic components, typically Integrated Circuits (ICs) like CPUs, GPUs, or FPGAs. --- ## Technical Specifications The following table details the mechanical and thermal properties of the part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45mm x 45mm x 10mm | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 10.48°C/W (Unducted Flow @ 200 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ## Electronic & Design Features ### 1. Thermal Management The primary electronic function of this part is **heat dissipation**. It prevents thermal throttling or permanent damage to electronic components by transferring heat from the semiconductor junction to the surrounding air. The low profile (10mm height) makes it ideal for compact electronic enclosures. ### 2. Push-Pin Attachment System Unlike adhesive-based heat sinks, the "03F" series uses a mechanical push-pin system: * **Precision Mounting:** Ensures consistent pressure across the surface of the chip. * **Reliability:** Provides better long-term stability compared to thermal tape, which can degrade over time due to heat cycles. * **Hole Pattern:** Requires specific pre-drilled holes on the Printed Circuit Board (PCB). ### 3. Fin Design (Cross-Cut) The heat sink features a **straight fin** or **cross-cut** design. This allows for multi-directional airflow, making it effective in electronic systems where the direction of the cooling fan's exhaust might vary. ### 4. Thermal Interface Material (TIM) The part comes with **T766** pre-applied. In electronics, the TIM is crucial because it fills microscopic air gaps between the component and the heat sink, significantly reducing thermal resistance and improving heat transfer efficiency. --- ## Component Nomenclature Breakdown | Code | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **03F** | Push-Pin Series / Attachment style | | **117** | Specific Model/Size Reference | | **C2** | Performance/Finish code (Blue Anodized) | | **R0** | RoHS Compliant status |
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for the ATS-03F-117-C2-R0 push-pins?
    • ⤷ How does the T766 thermal interface material compare to other TIMs?
    • ⤷ What is the recommended airflow (LFM) for optimal cooling with this heat sink?