The **ATS-03F-128-C2-R0** is a high-performance electronic thermal management component, specifically a **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | push-PIN™ | | **Thermal Resistance (Flowing)** | 2.91 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 5.38 °C/W | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 15.00mm | | **Pin Pitch** | 47.00mm | --- ### 2. Design Characteristics #### Heat Sink Profile: Flat Back The "128" series features a **cross-cut** fin design. This provides a high surface area for heat dissipation while allowing airflow from multiple directions, making it more versatile than straight-fin designs in complex enclosures. #### Thermal Interface Material (TIM) The "C2" suffix typically indicates that the heat sink comes pre-applied with **ATS-PPS-07**, a high-performance phase-change thermal interface material. This ensures optimal thermal contact between the component and the heat sink. #### Attachment System (push-PIN™) The "R0" designation refers to the mounting hardware. This model uses a **push-pin** system with a compression spring. * **Benefits:** Provides precise pressure (load) to the component, improving heat transfer. * **Installation:** Requires pre-drilled holes in the PCB at a 47mm pitch. --- ### 3. Application Use Cases The ATS-03F-128-C2-R0 is commonly found in: * **Telecommunications:** High-speed routers and switches. * **Embedded Systems:** Industrial PCs and single-board computers. * **Power Electronics:** Cooling for MOSFETs and IGBT modules. --- ### 4. Cooling Performance Comparison Below is a simplified view of how airflow (LFM - Linear Feet per Minute) affects the thermal resistance of this specific part: | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 2.91 | | 300 (1.5 m/s) | 1.56 | | 500 (2.5 m/s) | 1.26 | | 700 (3.5 m/s) | 1.11 |