ATS-03F-148-C2-R0
AI

The part number **ATS-03F-148-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "blue ICE" or high-efficiency push-pin series designed for cooling electronic components like CPUs, GPUs, or FPGAs.
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### 1. Technical Specifications
The following table highlights the primary physical and thermal characteristics of this specific component:
| Characteristic | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic) |
| **Dimensions (L x W)** | 30mm x 30mm |
| **Height** | 15mm |
| **Fin Type** | Fine Pitch (Square Fin) |
| **Thermal Resistance** | 8.59°C/W (at 200 LFM) |
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### 2. Detailed Breakdown of the Part Number
The part number can be decoded to understand the specific configuration:
* **ATS**: Manufacturer (Advanced Thermal Solutions).
* **03**: Standard series designation.
* **F**: Fin pitch/style (typically indicates a specific fin density).
* **148**: Specific size and configuration identifier within the catalog.
* **C2**: Refers to the **Thermal Interface Material (TIM)**. C2 usually indicates a high-performance thermal pad or pre-applied phase-change material (T766).
* **R0**: RoHS compliance status (lead-free).
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### 3. Key Features
* **Push-Pin Attachment:** This model uses a spring-loaded push-pin mechanism. This provides consistent pressure for optimal heat transfer and makes it easier to install than adhesive-based heat sinks.
* **Cross-Cut Fin Design:** The "Square Fin" or cross-cut pattern allows for air to flow through the heat sink from multiple directions, making it more efficient in turbulent or omnidirectional airflow environments.
* **Pre-applied TIM:** It comes with a pre-applied thermal interface material, which reduces assembly time and ensures a reliable thermal bond between the chip and the aluminum.
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### 4. Application Use Cases
This heat sink is typically found in:
1. **Networking Hardware:** Cooling ASICs in routers and switches.
2. **Embedded Systems:** Industrial PCs or single-board computers.
3. **Power Supplies:** Managing heat for voltage regulators or power transistors.
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What are the alternative attachment methods for heat sinks besides push-pins?
- ⤷ How do I calculate if the 8.59°C/W thermal resistance is sufficient for my component?
- ⤷ What is the difference between blue anodized and black anodized finishes in terms of thermal performance?