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  • ATS-03F-148-C2-R0

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    The part number **ATS-03F-148-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "blue ICE" or high-efficiency push-pin series designed for cooling electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table highlights the primary physical and thermal characteristics of this specific component: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W)** | 30mm x 30mm | | **Height** | 15mm | | **Fin Type** | Fine Pitch (Square Fin) | | **Thermal Resistance** | 8.59°C/W (at 200 LFM) | --- ### 2. Detailed Breakdown of the Part Number The part number can be decoded to understand the specific configuration: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **03**: Standard series designation. * **F**: Fin pitch/style (typically indicates a specific fin density). * **148**: Specific size and configuration identifier within the catalog. * **C2**: Refers to the **Thermal Interface Material (TIM)**. C2 usually indicates a high-performance thermal pad or pre-applied phase-change material (T766). * **R0**: RoHS compliance status (lead-free). --- ### 3. Key Features * **Push-Pin Attachment:** This model uses a spring-loaded push-pin mechanism. This provides consistent pressure for optimal heat transfer and makes it easier to install than adhesive-based heat sinks. * **Cross-Cut Fin Design:** The "Square Fin" or cross-cut pattern allows for air to flow through the heat sink from multiple directions, making it more efficient in turbulent or omnidirectional airflow environments. * **Pre-applied TIM:** It comes with a pre-applied thermal interface material, which reduces assembly time and ensures a reliable thermal bond between the chip and the aluminum. --- ### 4. Application Use Cases This heat sink is typically found in: 1. **Networking Hardware:** Cooling ASICs in routers and switches. 2. **Embedded Systems:** Industrial PCs or single-board computers. 3. **Power Supplies:** Managing heat for voltage regulators or power transistors.
    ✨ Follow-up Questions
    • ⤷ What are the alternative attachment methods for heat sinks besides push-pins?
    • ⤷ How do I calculate if the 8.59°C/W thermal resistance is sufficient for my component?
    • ⤷ What is the difference between blue anodized and black anodized finishes in terms of thermal performance?