The part number **ATS-03F-157-C2-R0** refers to a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "pushPIN™" series, designed for efficient cooling of electronic components like CPUs, GPUs, and other high-heat surface-mount devices. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Parameter | Specification | |:---|:---| | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (with Blue Anodized Finish) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 20.00mm | | **Fin Style** | XC-Cut (Cross-cut / Pin Fin) | | **Thermal Resistance** | 3.35°C/W (at 100 LFM) | | **Thermal Interface Material** | T766 (Pre-applied Phase Change Material) | --- ### 2. Breakdown of the Part Number The nomenclature used by ATS follows a specific logic to identify the heatsink's properties: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **03**: Attachment style (Push-pin). * **F**: Pitch/Material variation. * **157**: Specific geometric design code (40x40x20mm). * **C2**: Material/Finish (Aluminum / Blue Anodized). * **R0**: Revision or packaging code. --- ### 3. Key Electronic Cooling Features #### **A. XC-Cut Fin Design** The "XC-Cut" refers to the cross-cut fin pattern. Unlike straight fins, this design allows for air to pass through from multiple directions, making it highly effective in systems where airflow direction might be irregular or obstructed. #### **B. pushPIN™ Attachment** This part uses a specialized attachment mechanism consisting of: * **Brass/Plastic Pins:** Used to secure the heatsink to the PCB through pre-drilled holes. * **Compression Springs:** Provides precise, uniform pressure across the thermal interface, ensuring maximum heat transfer without damaging the electronic component. #### **C. Thermal Interface Material (TIM)** The **T766** material pre-applied to the base is a high-performance phase-change material. When the component heats up, the TIM softens to fill microscopic air gaps between the component die and the heatsink base, significantly reducing thermal resistance. --- ### 4. Typical Applications This specific size and thermal rating are commonly used for: * **Networking Equipment:** High-speed routers and switches. * **Embedded Systems:** Industrial PC boards. * **Power Electronics:** Voltage regulator modules (VRMs).