ATS-03F-169-C2-R0
AI

The **ATS-03F-169-C2-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **push-pin** attachment series and is specifically designed for cooling electronic components such as CPUs, GPUs, and other high-heat-density integrated circuits.
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### 1. Technical Specifications
The following table summarizes the key physical and thermal properties of this component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic) |
| **Dimensions (L x W x H)** | 30.0mm x 30.0mm x 10.0mm |
| **Thermal Resistance** | 15.71 °C/W (at 200 LFM) |
| **Fin Style** | Straight Fin |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
---
### 2. Breakdown of Component Parts
#### A. The Heat Sink Body
The main body is made of **Aluminum 6063**, which offers a high thermal conductivity-to-weight ratio. The **Blue Anodized** coating is not just for aesthetics; it provides corrosion resistance and increases surface emissivity, which slightly improves radiation cooling.
#### B. The Fin Array
The "Straight Fin" design is optimized for **forced convection** (using a fan). The fins are spaced to allow air to flow through the channels, carrying heat away from the baseplate.
#### C. The Attachment System (Push-Pins)
Unlike adhesive-based heat sinks, the ATS-03F uses a mechanical push-pin system:
* **Pins:** Usually made of nylon or plastic, these snap into pre-drilled holes in the PCB.
* **Springs:** Each pin has a compression spring that provides consistent pressure (load) on the component, ensuring the best possible contact.
#### D. Thermal Interface Material (TIM)
The part comes with **T766** pre-applied to the bottom surface. This is a "Phase Change Material" that fills microscopic air gaps between the chip and the heat sink, significantly reducing thermal resistance.
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### 3. Part Number Decoding (ATS System)
The part number follows a specific nomenclature:
* **ATS**: Advanced Thermal Solutions (Manufacturer).
* **03**: Standard product series.
* **F**: Fin pitch/density indicator.
* **169**: Specific dimension/geometry code.
* **C2**: Refers to the material and finish (Aluminum/Blue Anodized).
* **R0**: Version or revision code.
---
### 4. Application Integration
In an electronic design, you would represent this in your CAD/BOM as follows:
```yaml
Part_Number: ATS-03F-169-C2-R0
Category: Thermal Management
Mounting_Type: Through-hole (2-Pushpin)
Airflow_Direction: Horizontal/Lateral
```
- ⤷What are the PCB hole diameter requirements for the push-pin mounting?
- ⤷ How does the T766 interface material compare to standard thermal grease?
- ⤷ What is the recommended airflow (LFM) for optimal performance of this heat sink?