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  • ATS-03F-169-C2-R0

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    The **ATS-03F-169-C2-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **push-pin** attachment series and is specifically designed for cooling electronic components such as CPUs, GPUs, and other high-heat-density integrated circuits. --- ### 1. Technical Specifications The following table summarizes the key physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W x H)** | 30.0mm x 30.0mm x 10.0mm | | **Thermal Resistance** | 15.71 °C/W (at 200 LFM) | | **Fin Style** | Straight Fin | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Breakdown of Component Parts #### A. The Heat Sink Body The main body is made of **Aluminum 6063**, which offers a high thermal conductivity-to-weight ratio. The **Blue Anodized** coating is not just for aesthetics; it provides corrosion resistance and increases surface emissivity, which slightly improves radiation cooling. #### B. The Fin Array The "Straight Fin" design is optimized for **forced convection** (using a fan). The fins are spaced to allow air to flow through the channels, carrying heat away from the baseplate. #### C. The Attachment System (Push-Pins) Unlike adhesive-based heat sinks, the ATS-03F uses a mechanical push-pin system: * **Pins:** Usually made of nylon or plastic, these snap into pre-drilled holes in the PCB. * **Springs:** Each pin has a compression spring that provides consistent pressure (load) on the component, ensuring the best possible contact. #### D. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the bottom surface. This is a "Phase Change Material" that fills microscopic air gaps between the chip and the heat sink, significantly reducing thermal resistance. --- ### 3. Part Number Decoding (ATS System) The part number follows a specific nomenclature: * **ATS**: Advanced Thermal Solutions (Manufacturer). * **03**: Standard product series. * **F**: Fin pitch/density indicator. * **169**: Specific dimension/geometry code. * **C2**: Refers to the material and finish (Aluminum/Blue Anodized). * **R0**: Version or revision code. --- ### 4. Application Integration In an electronic design, you would represent this in your CAD/BOM as follows: ```yaml Part_Number: ATS-03F-169-C2-R0 Category: Thermal Management Mounting_Type: Through-hole (2-Pushpin) Airflow_Direction: Horizontal/Lateral ```
    ✨ Follow-up Questions
    • ⤷What are the PCB hole diameter requirements for the push-pin mounting?
    • ⤷ How does the T766 interface material compare to standard thermal grease?
    • ⤷ What is the recommended airflow (LFM) for optimal performance of this heat sink?