The part number **ATS-03F-17-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "pushPIN™" component cooling series, designed specifically for thermal management of electronic components like CPUs, GPUs, and power modules. ### 1. Technical Specifications The table below highlights the key physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 35.00 mm x 35.00 mm | | **Height** | 12.70 mm | | **Pitch** | COARSE-PITCH (Square Fin) | | **Thermal Resistance** | 15.44 °C/W (at 100 LFM) | | **Compliance** | RoHS-6 and REACH compliant | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by Advanced Thermal Solutions: - **ATS-03**: The series identifier (pushPIN™ Heat Sink Assembly). - **F**: Indicates the attachment type or specific fin pattern (Cross-cut). - **17**: Refers to the specific fin geometry/designation. - **C2**: Refers to the **Thermal Interface Material (TIM)** applied. In this case, it typically signifies **T766** (a high-performance thermal grease). - **R0**: Indicates the version or revision (Standard production). --- ### 3. Key Electronic Functions While this is a mechanical part, its role in an electronic circuit is critical for stability and longevity: - **Thermal Dissipation:** It increases the surface area of a semiconductor package, allowing heat to move from the junction to the ambient air more efficiently. - **PushPIN™ Technology:** This part uses a flexible attachment system that includes a brass or plastic pin and a stainless steel spring. This ensures even pressure across the electronic component, preventing "tilting" which can cause localized hotspots. - **Thermal Interface Material (TIM):** The "C2" designation means it comes pre-applied with a thermal compound. This fills microscopic air gaps between the chip and the heat sink, significantly reducing thermal resistance. --- ### 4. Application Use Cases This specific size (35mm x 35mm) is commonly used for: 1. **FPGA/ASIC Cooling:** Integrated circuits that generate moderate heat during logic processing. 2. **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators. 3. **Embedded Systems:** Cooling processors in industrial or automotive computing modules.