The **ATS-03F-180-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is a critical passive electronic component used for thermal management in dense electronic assemblies. --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Fin Type** | Fine-Pitch | | **Fin Pattern** | Cross-Cut | | **Dimensions** | 35.00mm x 35.00mm | | **Height** | 25.00mm | | **Thermal Resistance (Unducted)** | 3.32 °C/W @ 100 LFM | --- ## 2. Key Design Features ### pushPIN™ Attachment Unlike adhesive tapes or simple clips, this model uses a **pushPIN™ system**. This includes a flexible spring-loaded mechanism that provides consistent pressure to the component (CPU, GPU, or FPGA), ensuring maximum heat transfer across the interface. ### Fine-Pitch Fin Design The "Fine-Pitch" design increases the surface area significantly. This allows the heat sink to dissipate more heat in environments with constrained airflow, making it ideal for high-density PCB layouts. ### Cross-Cut Pattern The fins are cut in both vertical and horizontal directions. This allows air to enter and exit from multiple angles, reducing "shadowing" effects where downstream components are starved of cool air. --- ## 3. Thermal Performance Comparison Thermal resistance indicates how efficiently the part moves heat away from the component. Lower values are better. | Airflow Velocity (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 3.32 | | 300 | 1.5 | 1.82 | | 500 | 2.5 | 1.44 | | 700 | 3.5 | 1.25 | --- ## 4. Common Applications * **Telecommunications:** Cooling of high-speed networking chips. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling MOSFETs and power regulators. * **Computing:** Secondary cooling for chipsets or small form-factor CPUs.