The **ATS-03F-181-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions, Inc. (ATS). Below is a detailed breakdown of its electronic and mechanical specifications. --- ### 1. Key Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Base Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 11.95°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W)** | 40mm x 40mm | | **Height** | 10mm | --- ### 2. Design and Functional Features #### A. Fin Geometry This model utilizes a **Cross-Cut** fin design. Unlike straight fins, cross-cut fins allow for multi-directional airflow, making it highly effective in compact electronic enclosures where the direction of the air from cooling fans may be turbulent or non-linear. #### B. Push-Pin Attachment Mechanism The "03F" in the part number indicates a specific push-pin configuration. This mechanism: * Provides a **consistent pressure** across the interface of the electronic component (CPU, GPU, or MOSFET). * Eliminates the need for messy adhesives or complicated screw-mounting. * Uses a pre-drilled hole pattern on the PCB for secure fastening. #### C. Thermal Interface Material (TIM) The **R0** suffix typically indicates that the heat sink comes with a pre-applied high-performance **Thermal Interface Material**. This fills the microscopic air gaps between the component and the heat sink base, significantly reducing thermal resistance. --- ### 3. Application Use Cases This specific heat sink is designed for low-profile electronics where vertical space is limited (10mm height). Common applications include: * **Telecommunications:** Network switches and routers. * **Embedded Systems:** Single-board computers (SBCs) and industrial PCs. * **Power Electronics:** Cooling for high-power transistors or voltage regulators. --- ### 4. Thermal Performance Comparison The performance varies based on the airflow (velocity) provided by the system fans: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 11.95 | | 300 (1.5 m/s) | 5.36 | | 500 (2.5 m/s) | 3.83 |