The part number **ATS-03F-184-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" attachment series designed for cooling electronic components like CPUs, GPUs, and other high-heat integrated circuits. --- ### Technical Specifications | Parameter | Specification | |:---|:---| | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 4.14°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 25mm | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### Key Electronic & Mechanical Components #### 1. Heat Sink Body (Finned Design) The body is made of high-grade aluminum. It utilizes a **Straight Fin** pattern, which is optimized for unidirectional airflow. The 25mm height provides a large surface area to dissipate heat from the component into the surrounding air. #### 2. Push Pin Attachment System Unlike adhesive-based heat sinks, the `-R0` suffix indicates a mechanical push pin system. * **Brass Push Pins:** These provide a secure, vibration-resistant connection to the PCB. * **Compression Springs:** These ensure constant pressure is applied to the chip, which is critical for maintaining effective thermal contact. #### 3. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. * **Function:** It fills microscopic air gaps between the heat sink and the electronic component (die/package). * **Benefit:** This minimizes thermal resistance at the contact point, allowing heat to flow more efficiently. #### 4. Blue Anodized Finish The blue coating is not just for aesthetics; anodizing increases the surface emissivity, slightly improving radiant heat transfer and providing corrosion resistance for the aluminum body. --- ### Use Cases in Electronics * **Telecommunications:** Cooling high-speed networking processors. * **Embedded Systems:** Industrial PCs where mechanical stability (push pins) is required over simple tape. * **Power Electronics:** Dissipating heat from MOSFET arrays or voltage regulators.