The **ATS-03F-189-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series, designed for efficient thermal management of electronic components like CPUs, GPUs, and power modules. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 45mm x 45mm x 20mm | | **Fin Type** | Fine Pitch (Cross-cut) | | **Thermal Resistance (Unducted)** | 4.74 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 1.60 °C/W @ 100 LFM | --- ### 2. Key Components & Features #### A. Thermal Interface Material (TIM) The "C2" in the part number indicates that this unit comes pre-applied with **T766 Phase Change Material**. This is a high-performance interface that fills microscopic air gaps between the heat source and the heat sink to maximize heat transfer. #### B. Attachment System: pushPIN™ Instead of using adhesive tapes or simple clips, this model uses a **pushPIN™** system: * **Springs:** Provides consistent pressure (Pre-assembled compression springs). * **Pins:** Available in brass or plastic; designed to lock into the PCB holes for a secure fit. * **Reliability:** Ensures the heat sink stays in contact with the chip even under high vibration or thermal expansion. #### C. Fin Design The heat sink utilizes a **cross-cut** design. This creates a large surface area in a small footprint and allows for airflow from multiple directions, making it ideal for systems with complex internal air currents. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying its specific role: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **03** | Push-pin style/attachment series | | **F** | Fin pitch (Fine) | | **189** | Specific size/geometry code | | **C2** | Thermal Interface Material (T766) | | **R0** | RoHS compliant / Revision status | --- ### 4. Application Use-Cases * **Embedded Systems:** Cooling processors in industrial computers. * **Telecommunications:** Dissipating heat from high-speed networking chips. * **Power Supplies:** Cooling MOSFETs or power regulators that require a rigid mounting solution.