ATS-03F-191-C2-R0
AI

The **ATS-03F-191-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the "push-pin" series designed for securing the sink directly to a Printed Circuit Board (PCB).
---
### 1. Technical Specifications
Below is a breakdown of the physical and thermal properties of this specific model:
| Property | Description / Value |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Type** | Push-Pin (Plastic) |
| **Thermal Resistance** | 2.90°C/W (at 200 LFM) |
| **Dimensions (L x W)** | 45mm x 45mm |
| **Height** | 20mm |
| **Fin Style** | Straight Fin |
---
### 2. Electronic/Mechanical Functionality
#### A. Thermal Dissipation
The primary electronic role of this part is to increase the surface area of a semiconductor (like a CPU, GPU, or FPGA). By drawing heat away from the die and into the aluminum fins, it prevents **thermal throttling** or permanent hardware damage caused by overheating.
#### B. The Push-Pin Mechanism
Unlike adhesive-based heat sinks, the "03F" designation indicates a specific attachment method:
* **Spring-Loaded Pins:** Provides consistent downward pressure on the electronic component, ensuring maximum contact with the thermal interface material (TIM).
* **Bore Holes:** Requires two pre-drilled holes in the PCB.
#### C. Airflow Optimization
The straight-fin design is optimized for **forced air cooling** (fans). In an electronic enclosure, the orientation of these fins should align with the direction of the system's airflow to minimize static pressure and maximize heat transfer.
---
### 3. Usage Context
This part is typically found in:
* **Networking Hardware:** Routers, switches, and base stations.
* **Industrial PCs:** Controllers that run 24/7 and require passive or active cooling.
* **Power Electronics:** Voltage regulators or high-power transistors.
---
- ⤷
What is the difference between blue anodized and black anodized heat sinks?
- ⤷ How do I calculate if 2.90°C/W is sufficient for my specific processor?
- ⤷ What type of Thermal Interface Material (TIM) is recommended for push-pin heat sinks?