The **ATS-03F-196-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of this specific model: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions** | 45mm x 45mm x 10mm | | **Fin Pattern** | Straight Fin | | **Thermal Resistance** | 18.26°C/W (Unducted Flow @ 100 LFM) | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ## 2. Key Component Features ### A. pushPIN™ Attachment Unlike adhesive tapes that can fail over time or standard clips, this part uses a **pushPIN™** system. This consists of a plastic or metal pin with a compression spring. * **Benefits:** Ensures precise pressure (clamping force) for optimal heat transfer and prevents the heat sink from shifting during vibration or shipping. ### B. T412 Thermal Interface Material The "C3" in the part number indicates the specific thermal interface material. * **Function:** It fills the microscopic air gaps between the component (chip) and the heat sink base. * **Performance:** T412 is a high-performance phase-change material that offers low thermal impedance. ### C. Low Profile Design With a height of only **10mm**, this heat sink is designed for "thin" applications such as 1U servers, blade modules, or compact embedded systems where vertical space is limited. --- ## 3. Thermal Performance Analysis The efficiency of the ATS-03F-196-C3-R0 is highly dependent on the Airflow (Measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural/Low) | 18.26 | | 300 (Moderate) | 9.10 | | 500 (High) | 7.00 | --- ## 4. Part Number Breakdown (Nomenclature) * **ATS**: Manufacturer (Advanced Thermal Solutions) * **03**: Attachment style / Series * **F**: Fin pitch (Fine) * **196**: Specific footprint/geometry code * **C3**: Thermal Interface Material type (T412) * **R0**: RoHS compliance status