The **ATS-03F-20-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number provides specific details about its dimensions, material, and thermal performance. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Base Dimensions** | 54mm x 54mm | | **Height** | 25mm | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 7.14°C/W (Unducted Flow @ 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Features * **pushPIN™ Attachment:** This model uses a specialized attachment system consisting of a spring-loaded pin. This ensures consistent pressure between the heat sink and the component, optimizing heat transfer. * **Cross-Cut Fin Design:** The "F" in the series often denotes a specific fin pattern (Cross-Cut). This design allows for multidirectional airflow, making it effective even if the air direction in the chassis is not strictly linear. * **T766 TIM:** It comes with pre-applied Thermal Interface Material. This eliminates the need for manual thermal paste application and ensures a high-quality bond between the heat source and the aluminum base. --- ### 3. Electronic Application This heat sink is typically used in the following electronic environments: 1. **High-Power Semiconductors:** Cooling MOSFETs or IGBTs in power supply units. 2. **Embedded Systems:** Providing passive or active cooling for ARM-based processors or FPGAs. 3. **Telecommunications:** Cooling chips on network switch line cards where vertical space (25mm) is available. --- ### 4. Thermal Performance Data Performance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Velocity (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 7.14 | | 200 | 1.0 | 2.32 | | 300 | 1.5 | 1.43 | | 400 | 2.0 | 1.08 | ---