The **ATS-03F-203-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) to prevent thermal throttling or hardware failure. --- ## 1. Key Technical Specifications The model number encodes specific physical and thermal characteristics: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Heat Sink Type** | XCUT (Fine pitch, cross-cut design) | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions** | 45mm x 45mm x 20mm | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 8.93°C/W (Unducted Flow @ 200 LFM) | --- ## 2. Functional Components ### A. The Heat Sink Body * **Material:** Made of high-grade aluminum for a balance between thermal conductivity and weight. * **Fin Design:** It features a **Straight Fin/Cross-cut** pattern. This maximizes surface area while allowing airflow from multiple directions, making it versatile for different PCB layouts. * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied. This is a "phase change" material that fills microscopic air gaps between the CPU/GPU and the heat sink for better heat transfer. ### B. The Attachment Mechanism (Push-Pin) * **Hardware:** It utilizes a **Push-Pin and Spring** assembly. * **Benefit:** This provides consistent pressure (load) on the component being cooled, which is critical for maintaining a reliable thermal bond. The springs are designed to meet specific industry "pull-off" force requirements. --- ## 3. Thermal Performance Profile Thermal resistance is measured in °C/W (degrees Celsius per Watt). A lower number indicates better cooling. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 8.93 | | 400 (2.0 m/s) | 4.89 | | 600 (3.0 m/s) | 3.59 | --- ## 4. Typical Applications This part is commonly used in industrial and computing environments for: * **FPGAs and ASICs:** High-speed processing chips that generate significant heat. * **Network Switches:** Cooling the primary switching fabric chips. * **Power Supplies:** Managing heat in voltage regulators or power converters. ---