The **ATS-03F-208-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the dimensions, fin pattern, and material properties. | Specification | Detail | | :--- | :--- | | **Component Type** | Heat Sink | | **Series** | pushPIN™ | | **Heat Sink Type** | XCUT (Cross-cut) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 10.53°C/W (Unducted Flow) | | **Attachment Method** | Push-pin (Steel with Plastic Springs) | --- ### 2. Physical Dimensions Precision measurements are critical for PCB layout and clearance from adjacent components. | Dimension | Measurement | | :--- | :--- | | **Length/Width** | 70.00 mm x 70.00 mm | | **Height (Profile)** | 6.00 mm | | **Mounting Hole Spacing** | 63.00 mm | | **Weight** | ~45 Grams | --- ### 3. Key Electronic/Mechanical Features * **XCUT Fin Design:** The "XCUT" geometry features a cross-cut fin pattern. This creates a more turbulent airflow and allows for omni-directional cooling, meaning the air can enter from any side of the heat sink effectively. * **Low Profile (6mm):** This part is specifically designed for space-constrained electronic enclosures, such as 1U servers or thin embedded systems. * **Push-Pin Mounting:** Unlike adhesive-based heat sinks, the push-pin mechanism provides high mechanical stability and consistent pressure between the heat sink and the chip. * **Pre-Applied Thermal Interface (TIM):** Most "R0" variants come with a pre-applied high-performance thermal pad or grease (T766) to ensure immediate out-of-the-box installation with low contact resistance. --- ### 4. Thermal Performance Data Performance varies based on the airflow (Measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 10.53 | | 400 (2.0 m/s) | 4.36 | | 600 (3.0 m/s) | 2.81 | --- ### Application Example (BOM Integration) If you were documenting this part in a system design, it would look like this in a Markdown-formatted table: ```markdown | Ref Des | Part Number | Manufacturer | Description | | :--- | :--- | :--- | :--- | | HS1 | ATS-03F-208-C2-R0 | Advanced Thermal Solutions | 70x70x6mm XCUT Heat Sink, Blue Anodized | ```