The **ATS-03F-26-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling integrated circuits (ICs), such as CPUs, GPUs, or power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature from the manufacturer, **Advanced Thermal Solutions (ATS)**. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ HS | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 14.20°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W)** | 70mm x 70mm | | **Height** | 10mm | --- ### 2. Key Components & Design Features #### A. Fin Design (Flat Fin) The "F" in the part number indicates a **Flat Fin** geometry. This design is optimized for environments where there is a consistent, steady direction of airflow. Flat fins provide a large surface area for heat dissipation while maintaining a relatively low profile. #### B. Attachment: pushPIN™ System Unlike adhesive tapes or heavy screws, this unit uses a **Push-Pin** mechanism: * **Spring-Loaded:** Provides consistent pressure on the component to ensure optimal thermal contact. * **Ease of Install:** Can be installed manually or with basic tools into pre-drilled holes on the PCB. * **Durability:** The brass or plastic pins are designed for high-vibration environments. #### C. Thermal Interface Material (TIM) The part comes with **pre-applied thermal interface material**. This ensures that the microscopic gaps between the heatsink base and the electronic component are filled, reducing thermal impedance. --- ### 3. Application Use Cases This specific heatsink is typically used in hardware where vertical space is limited (10mm height) but the surface area of the chip is large (70x70mm). * **Networking Gear:** Routers, switches, and base stations. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Electronics:** Large MOSFET arrays or power conversion modules. --- ### 4. Part Number Breakdown (Logic) `ATS-03F-26-C2-R0` * **ATS:** Manufacturer (Advanced Thermal Solutions). * **03:** Specific series/designator. * **F:** Fin Type (Flat). * **26:** Dimensional/Size code. * **C2:** Thermal performance/material coating code. * **R0:** Revision or RoHS compliance status.