The **ATS-03F-27-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Feature | Specification | Detail | | :--- | :--- | :--- | | **Component Type** | Heat Sink | Passive cooling component | | **Material** | Aluminum | Lightweight with high thermal conductivity | | **Attachment Method** | push-pin™ | Secure mechanical fastening with springs | | **Dimension (L x W)** | 40mm x 40mm | Standard square footprint | | **Height** | 12.7mm | Low profile design | | **Fin Style** | Straight Fin | Optimizes airflow in a specific direction | | **Thermal Resistance** | 12.28°C/W (at 200 LFM) | Rate at which heat is transferred | | **Finish** | Blue Anodized | Protects against corrosion and increases emissivity | --- ### 2. Key Electronic Features #### A. Thermal Interface Material (TIM) The "C2" in the part number indicates the type of thermal interface material used. * **ATS-03F-27-C2-R0** comes pre-applied with **T766**, a high-performance thermal phase-change material. This ensures the best possible contact between the electronic component (heat source) and the aluminum base, minimizing air gaps. #### B. Push-Pin Mounting System Instead of using messy thermal adhesives or tapes, this unit uses a **push-pin and brass spring** mechanism. * **Reliability:** Provides consistent pressure across the chip surface. * **Ease of Install:** Allows for quick assembly on PCBs with pre-drilled holes (usually 3.0mm holes). #### C. Airflow Optimization The straight-fin design is engineered for **forced air environments**. This means the heat sink performs best when there is a fan directing air through the fins. --- ### 3. Common Applications This specific heat sink is typically found in the following electronic systems: 1. **Telecommunications:** Cooling of high-speed networking chips. 2. **Embedded Systems:** For industrial PCs where vertical space is limited (12.7mm height). 3. **Power Supplies:** Heat dissipation for MOSFETs and voltage regulators. --- ### 4. Thermal Performance Data Performance varies based on the velocity of the air moving through the system: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 12.28 | | 400 (2.0 m/s) | 5.14 | | 600 (3.0 m/s) | 3.67 |