The **ATS-03F-32-C3-R0** is a high-performance thermal management component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" heat sink series designed for cooling integrated circuits (ICs) and other electronic components. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 35.0mm x 35.0mm x 12.7mm | | **Attachment Method** | Push Pin (Plastic/Brass) | | **Thermal Resistance** | 21.54 °C/W (at 0 LFM) | | **Fin Type** | Cross-Cut (Pin Fin) | | **Interface Material** | T412 (Thermal Tape) | --- ## 2. Key Component Features ### A. Fin Geometry (Cross-Cut) Unlike traditional straight-fin heat sinks, the ATS-03F-32-C3-R0 uses a **cross-cut** or pin-fin design. * **Omnidirectional Airflow:** This allows air to enter the heat sink from any direction, making it ideal for systems where the airflow direction is inconsistent or blocked. * **Turbulence:** The pin structure increases air turbulence, which improves the efficiency of heat transfer from the metal to the surrounding air. ### B. Attachment Mechanism (Push Pin) The "F" in the part number often denotes the specific mounting hardware. * **Spring-Loaded:** The push pins use a compression spring to provide consistent pressure (Normal Force) on the CPU/GPU, ensuring the thermal interface material (TIM) makes perfect contact. * **Stability:** This mechanical attachment is more secure than simple adhesive tapes in high-vibration environments. ### C. Thermal Interface Material (T412) The unit comes pre-applied with **T412 thermal tape**. * **Function:** It fills the microscopic air gaps between the heat source and the aluminum base. * **Performance:** T412 is a high-performance, double-sided acrylic adhesive that provides excellent thermal conductivity while keeping the heat sink firmly in place. --- ## 3. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **03** | Series/Mounting style (Push Pin Type) | | **F** | Plastic Push Pin / Spring material indicator | | **32** | Dimension / Geometry identifier | | **C3** | Thermal Performance/Material grade (Blue Anodized) | | **R0** | Revision or RoHS Compliance status | --- ## 4. Application Use Cases This heat sink is typically found in: * **Networking Gear:** Switches and routers where airflow is pushed through dense PCB layouts. * **Embedded Systems:** Industrial PCs that require passive cooling or low-profile active cooling. * **Power Supplies:** Cooling MOSFETs or Voltage Regulators (VRMs).