The **ATS-03F-33-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions Inc.* It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ### 1. Technical Specifications The following table breaks down the core physical and thermal properties of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 17.50°C/W (Unducted Flow @ 100 LFM) | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Dimensions (L x W x H)** | 35mm x 35mm x 20mm | | **Fin Pattern** | Square Cross-Cut | --- ### 2. Key Electronic Features #### A. The pushPIN™ Attachment System Unlike adhesive-based heat sinks, the "33-C3" designation refers to a specialized push-pin mechanism. * **Benefits:** It provides consistent pressure (clamping force) across the component surface, which optimizes the interface between the heat sink and the chip. * **Reliability:** It prevents the heat sink from shifting due to mechanical shock or vibration, a common issue in industrial electronics. #### B. Thermal Interface Material (TIM) This model typically comes with **T766** pre-applied. * **Purpose:** The TIM fills microscopic air gaps between the component and the aluminum base to maximize heat transfer efficiency. #### C. Cross-Cut Fin Design The "33" in the part number indicates a specific fin density and geometry. * **Flow Dynamics:** The cross-cut pattern allows air to move through the sink from multiple directions (omnidirectional), making it ideal for systems where the airflow direction might be inconsistent. --- ### 3. Part Number Breakdown (Nomenclature) To understand exactly what the code represents: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **03F:** The specific series/frame size. * **33:** The fin configuration/height code. * **C3:** Material/Attachment kit code (often indicates specific spring/pin type). * **R0:** Revision code (Standard RoHS compliant version). --- ### 4. Integration Example If you were defining this part in a thermal simulation or Bill of Materials (BOM), you would treat it as a passive cooling component: ```yaml Component_ID: ATS-03F-33-C3-R0 Type: Passive_Heat_Sink Mounting: 2-hole_Push-Pin Pitch: 40.00mm (Distance between pins) Flow_Type: Unducted/Ducted Airflow_Direction: Omnidirectional ```