The **ATS-03F-41-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the *pushPIN™* series, designed for efficient cooling of semiconductor devices like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific model: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Mounting Type** | Push-Pin (Standard) | | **Fin Style** | Square Fin (XC-Cut) | | **Thermal Resistance** | 10.07°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 20.00mm | | **Attachment Method** | ATS-PP-06 (Push-pins and Springs) | --- ### 2. Breakdown of the Model Name Electronic parts often follow a nomenclature that describes their build. For the **ATS-03F-41-C3-R0**: * **ATS**: Advanced Thermal Solutions (Manufacturer). * **03**: Series designation. * **F**: Fin pitch/density (Fine pitch). * **41**: Specific size or base configuration. * **C3**: Indicates the Thermal Interface Material (TIM) pre-applied (usually a high-performance T766 phase-change material or T412 pad). * **R0**: Revision code. --- ### 3. Key Electronic Components & Features #### A. The Heat Sink Body The square-cut (XC-Cut) fin design provides a large surface area for heat dissipation. This design is optimized for "cross-flow" environments, meaning it works effectively even if the airflow direction is not perfectly aligned with the fins. #### B. Push-Pin Attachment Mechanism This part uses a specific push-pin system (`ATS-PP-06`). In PCB design: * The pins are made of **Brass or Plastic**. * The springs provide **Precise Pressure** to ensure maximum contact between the heat sink and the electronic component without cracking the silicon die. #### C. Thermal Interface Material (TIM) The "C3" designation means the part comes with a pre-applied thermal pad. This eliminates the need for manual application of thermal paste, ensuring a uniform layer that reduces the "thermal contact resistance" between the electronic chip and the aluminum base. --- ### 4. Typical Applications * **Voltage Regulator Modules (VRMs):** Cooling power-heavy components on motherboards. * **Embedded Systems:** Cooling processors in industrial computers. * **Telecommunications:** Used on high-speed data processing chips.